Annika Wilde (Ruhr University Bochum), Tim Niklas Gruel (Ruhr University Bochum), Claudio Soriente (NEC Laboratories Europe), Ghassan Karame (Ruhr University Bochum)

An increasing number of distributed platforms combine Trusted Execution Environments (TEEs) with blockchains. Indeed, many hail the combination of TEEs and blockchains a good “marriage”: TEEs bring confidential computing to the blockchain while the consensus layer could help defend TEEs from forking attacks.

In this paper, we systemize how current blockchain solutions integrate TEEs and to what extent they are secure against forking attacks. To do so, we thoroughly analyze 29 proposals for TEE-based blockchains, ranging from academic proposals to production-ready platforms. We uncover a lack of consensus in the community on how to combine TEEs and blockchains. In particular, we identify four broad means to interconnect TEEs with consensus, analyze their limitations, and discuss possible remedies. Our analysis also reveals previously undocumented forking attacks on three production-ready TEE-based blockchains: Ten, Phala, and the Secret Network. We leverage our analysis to propose effective countermeasures against those vulnerabilities; we responsibly disclosed our findings to the developers of each affected platform.

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Qihang Zhou (Institute of Information Engineering, Chinese Academy of Sciences), Wenzhuo Cao (Institute of Information Engineering, Chinese Academy of Sciences; School of Cyberspace Security, University of Chinese Academy of Sciences), Xiaoqi Jia (Institute of Information Engineering, Chinese Academy of Sciences), Peng Liu (The Pennsylvania State University, USA), Shengzhi Zhang (Department of Computer Science, Metropolitan College,…

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Xiaoguang Li (Xidian University, Purdue University), Zitao Li (Alibaba Group (U.S.) Inc.), Ninghui Li (Purdue University), Wenhai Sun (Purdue University, West Lafayette, USA)

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Jian Cui (Indiana University), Hanna Kim (KAIST), Eugene Jang (S2W Inc.), Dayeon Yim (S2W Inc.), Kicheol Kim (S2W Inc.), Yongjae Lee (S2W Inc.), Jin-Woo Chung (S2W Inc.), Seungwon Shin (KAIST), Xiaojing Liao (Indiana University)

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